| Quantity: | |
|---|---|
specifications:
Place of origin | Jiangsu, China |
Technology | Electroplated |
Diameter (mm) | 100 |
Inner diameter (mm) | 20 |
Thickness (mm) | 36 |
Weight (g) | 552 |
Color | Silver |
Shape | Bowl |
Tool | Angle grinder |
Description:
1、Electroplating Process: Utilizing electrodeposition technology, diamond particles are uniformly bonded to the substrate surface without high-temperature sintering. This method preserves the inherent sharpness of the diamonds and prevents thermal damage to the substrate.
2、Cup-Shaped Wheel Design:The grinding wheel features a bowl-type (cup-shaped) structure, with a peripheral grinding ring as the primary abrasive surface.The concave inner profile increases contact area with the workpiece, making it ideal for flat surface grinding, edge chamfering, and complex contour machining.Integrated heat dissipation grooves in the base enhance airflow and debris removal, effectively reducing heat buildup and minimizing thermal deformation of the workpiece.
Detailed Images
specifications:
Place of origin | Jiangsu, China |
Technology | Electroplated |
Diameter (mm) | 100 |
Inner diameter (mm) | 20 |
Thickness (mm) | 36 |
Weight (g) | 552 |
Color | Silver |
Shape | Bowl |
Tool | Angle grinder |
Description:
1、Electroplating Process: Utilizing electrodeposition technology, diamond particles are uniformly bonded to the substrate surface without high-temperature sintering. This method preserves the inherent sharpness of the diamonds and prevents thermal damage to the substrate.
2、Cup-Shaped Wheel Design:The grinding wheel features a bowl-type (cup-shaped) structure, with a peripheral grinding ring as the primary abrasive surface.The concave inner profile increases contact area with the workpiece, making it ideal for flat surface grinding, edge chamfering, and complex contour machining.Integrated heat dissipation grooves in the base enhance airflow and debris removal, effectively reducing heat buildup and minimizing thermal deformation of the workpiece.
Detailed Images
