Dr. John Patten, a professor of manufacturing engineering at Western Michigan University, has developed a micro-laser-assisted processing technology called "μ-LAM", which combines lasers with diamond tools to heat, soften and cut silicon semiconductors and ceramic materials.John Patten said, "These
The commonly used binders for diamond abrasives and cubic boron nitride abrasives are resin binders, ceramic binders, metal binders and electroplating binders. Metal binders include bronze binders, cast iron binders and cast iron short fiber binders. Their performance and application range are diffe
