1. Standard specificationThe thinnest specification of diamond grinding wheel is usually determined by two parameters: diameter and thickness. Common diameter specifications include 4 inches, 5 inches, 6 inches, etc., while the thickness is usually between 0.8 mm and 2 mm.2. Thinner specificationThe
Electroplated diamond grinding wheel is a diamond grinding wheel made by electrochemical method. The working layer of the grinding wheel contains diamond abrasive grains, and the diamond abrasive is bonded to the substrate by a metal binder. First, the thickness of the metal binder is deposited to b
Dr. John Patten, a professor of manufacturing engineering at Western Michigan University, has developed a micro-laser-assisted processing technology called "μ-LAM", which combines lasers with diamond tools to heat, soften and cut silicon semiconductors and ceramic materials.John Patten said, "These
